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ACTA AERONAUTICAET ASTRONAUTICA SINICA ›› 2006, Vol. 27 ›› Issue (6): 1223-1228.

• 论文 • Previous Articles     Next Articles

Study on Simulation and Experimentation of H Wallboard for RTM Processing

DUAN Yue-xin, SUN Yu-min, ZHANG Zuo-guang   

  1. School of Material Science and Engineering, Beijing University of Aeronautics and Astronautics, Beijing 100083, China
  • Received:2005-06-29 Revised:2005-10-08 Online:2006-12-25 Published:2006-12-25

Abstract: Resin Transfer Molding(RTM) filling process of an H wallboard is simulated in 3D using the simulation system. This system was developed by Beijing University of Aeronautics and Astronautics independently. After analysis of the simulation results, the optimal injection way is set as center point injection and 8 reasonable vents are settled. Also, the effects of preform inhomogeneous permeability on RTM process are studied particularly. Mould manufacture and filling experiment are operated, the experiment results coincide with the simulation results basically. RTM process simulation gives veracious guidance to mould development and component manufacture.

Key words: composite, resin transfer molding(RTM), simulation, permeability, H-wallboard

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