Abstract: This paper is mainly about the resin matrix rheology regularity during the composite curing process. The bisphenol epoxy resin is used as the research object, and its DSC curve, viscosity-temperature curve and viscosity-rate curve are measured, the rheology activation energy is worked out, and then the regularities of the effects of temperature, temperature increase rate and shear rate are analyzed. Base on a lot of experiments, the rheology activation energy, exponential parameter of the Arrhenius equation and the viscosity parameter of the Power equation were expressed by temperature increase rate, and the viscosity equations of two resin system are established. With a definite resin system, these numerical models have a certain extent commonality for different curing processes.

Key words: composite, rheology regularity, press molding, epoxy resin