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ACTA AERONAUTICAET ASTRONAUTICA SINICA ›› 1997, Vol. 18 ›› Issue (1): 123-126.

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MICROSTRUCTURE AND STABILITY OF SILICON CARBIDE CHEMICAL VAPOR DEPOSITED AT NORMAL ATMOSPHERE PRESSURE

Xu Yongdong, Zhang Litong, Cheng Laifei   

  1. State Key Laboratory of Solidification Processing, Northwestern Polytechnical University, Xi′an ,710072
  • Received:1995-10-23 Revised:1996-04-28 Online:1997-02-25 Published:1997-02-25

Abstract:

Microstructure, morphology, and thermal stability of silicon carbide were investigated which was chemical vapor deposited at normal atmosphere pressure in a CH 3SiCl 3 H 2 Ar system. At deposition temperature of 1300℃, the morphologies of SiC were whisker, film, and powder respectively as flow of H 2 was increased from 20, 200 to 700 ml·min 1 . The crystalline size and texture density of SiC film were increased with the increase of deposition temperatures when the flow of H 2 was maintained at 200 ml·min 1 . Within the present experimental conditions, the deposits were β SiC whose crystalline sizes were in 10 1nm scale. The crystal growth was observed after the deposit was annealed at temperature of 1550℃ in vacuum.

Key words: chemical vapor deposition, SiC microstr ucture, stability

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