细晶铝合金低温超声辅助TLP钎焊工艺及机理

doi:10.7527/S1000-6893.2021.26236

Abstract

Abstract: Fine grain aluminum alloy has the problems of poor thermal sensitivity and weldability, which limits its wide application in various fields. In this experiment, in order to reduce the property loss of base metal during the welding process, transient liquid phase soldering(TLP Soldering) is constructed. The effect of ultrasonic action time on the interface metallurgical reaction and mechanical properties of fine grain aluminum joint is studied at 400℃. Typical weld microstructure is composed of α-Al, β-Zn, eutectic microstructure and diffusion layer. With the increase of ultrasonic time, the content of Al in the weld increases gradually, and the β-Zn and eutectic structures decrease, while the content of α-Al and the thickness of diffusion layer increase gradually. Finally, a full α-Al solid solution joint is formed, and the shear strength reaches 238.5 MPa. with the time to 9 s.

Key words: fine grained aluminum alloy, ultrasonic assisted TLP soldering, ultrasonic time, organizational evolution, mechanical properties

CLC Number:

V252.2
TG454

WANG Jian, YANG Xiaoyu, LI Zhuolin, WANG Haoran, WU Xiaowei, SONG Xiaoguo. Process and mechanism of low-temperature ultrasonic assisted TLP soldering of fine grain aluminum alloy[J]. ACTA AERONAUTICAET ASTRONAUTICA SINICA, 2022, 43(12): 426236-426236.

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Process and mechanism of low-temperature ultrasonic assisted TLP soldering of fine grain aluminum alloy

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