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ACTA AERONAUTICAET ASTRONAUTICA SINICA ›› 2022, Vol. 43 ›› Issue (12): 426236.doi: 10.7527/S1000-6893.2021.26236

• Material Engineering and Mechanical Manufacturing • Previous Articles     Next Articles

Process and mechanism of low-temperature ultrasonic assisted TLP soldering of fine grain aluminum alloy

WANG Jian1,2, YANG Xiaoyu1,2, LI Zhuolin1,2, WANG Haoran1,2, WU Xiaowei1,2, SONG Xiaoguo1,2   

  1. 1. State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China;
    2. Shandong Provincial Key Lab of Special Welding Technology, Harbin Institute of Technology at Weihai, Weihai 264209, China
  • Received:2021-08-16 Revised:2021-09-22 Published:2021-10-18
  • Supported by:
    National Natural Science Foundation of China (51805111)

Abstract: Fine grain aluminum alloy has the problems of poor thermal sensitivity and weldability, which limits its wide application in various fields. In this experiment, in order to reduce the property loss of base metal during the welding process, transient liquid phase soldering(TLP Soldering) is constructed. The effect of ultrasonic action time on the interface metallurgical reaction and mechanical properties of fine grain aluminum joint is studied at 400℃. Typical weld microstructure is composed of α-Al, β-Zn, eutectic microstructure and diffusion layer. With the increase of ultrasonic time, the content of Al in the weld increases gradually, and the β-Zn and eutectic structures decrease, while the content of α-Al and the thickness of diffusion layer increase gradually. Finally, a full α-Al solid solution joint is formed, and the shear strength reaches 238.5 MPa. with the time to 9 s.

Key words: fine grained aluminum alloy, ultrasonic assisted TLP soldering, ultrasonic time, organizational evolution, mechanical properties

CLC Number: