航空学报 > 2022, Vol. 43 Issue (4): 525057-525057   doi: 10.7527/S1000-6893.2021.25057

钎焊时间对CoFeNiCrCu高熵钎料钎焊SiC陶瓷接头组织与性能的影响

王秒1, 王微2, 杨云龙1, 檀财旺3, 王刚1   

  1. 1. 安徽工程大学 材料科学与工程学院, 芜湖 241000;
    2. 安徽机电职业技术学院 航空与材料学院, 芜湖 241002;
    3. 哈尔滨工业大学 材料科学与工程学院, 威海 264209
  • 收稿日期:2020-12-04 修回日期:2020-12-21 出版日期:2022-04-15 发布日期:2021-03-01
  • 通讯作者: 王刚 E-mail:gangwang@ahpu.edu.cn
  • 基金资助:
    安徽省杰出青年基金(2008085J23);国家自然科学基金(51704001,52171148);安徽省优秀拔尖人才培养重点项目(gxyqZD2020059);安徽省领军骨干人才项目(Z175050020001);安徽工程大学引进人才科研启动基金(2020YQQ036);中国博士后科学基金(2021M690180)

Effect of brazing time on microstructure and properties of SiC ceramic brazed with CoFeNiCrCu

WANG Miao1, WANG Wei2, YANG Yunlong1, TAN Caiwang3, WANG Gang1   

  1. 1. School of Materials Science and Engineering, Anhui Polytechnic University, Wuhu 241000, China;
    2. School of Aviation and Materials, Anhui Machine and Electricity College, Wuhu 241002, China;
    3. School of Materials Science and Engineering, Harbin Institute of Technology, Weihai 264209, China
  • Received:2020-12-04 Revised:2020-12-21 Online:2022-04-15 Published:2021-03-01
  • Supported by:
    Natural Science Foundation of Anhui Province(2008085J23);National Natural Science Foundation of China (51704001,52171148);Talent and Top-notch Project of Anhui Province(gxyqZD2020059);Talent Project of Anhui Province (Z175050020001); Scientific Research Starting Foundation of Anhui Polytechnic University of China(2020YQQ036); China Postdoctoral Science Foundation(2021M690180)

摘要: 采用CoFeNiCrCu高熵合金为钎料对SiC陶瓷进行了钎焊连接,研究了钎焊时间对接头微观组织和力学性能的影响。结果表明,SiC/CoFeNiCrCu/SiC接头的典型界面组织为:SiC/Cr23C6+Cu (s,s)+Si (s,s)/HEAF+Cu (s,s)/Cr23C6+Cu (s,s)+Si (s,s)/SiC。随着钎焊时间的增加,组织中相的种类没有发生变化,接头在高熵效应的作用下仍主要由固溶体组成,接头中反应层厚度逐渐增大。当钎焊时间为90 min时,反应层厚度达到最大为25 μm。但过厚的反应层使得接头在冷却过程中产生的应力在反应层中集中并导致反应层中产生裂纹等缺陷。当钎焊温度为1 180℃,保温60 min时,接头剪切强度最高达到61 MPa。此时,裂纹从远离接头的SiC陶瓷开始萌生并向接头方向扩展,最终断裂在陶瓷与反应层的界面处。

关键词: SiC陶瓷, 高熵钎料, 钎焊, 界面组织, 力学性能

Abstract: The SiC ceramic was brazed by CoFeNiCrCu filler, and the effect of brazing time on the microstructure and mechanical properties of the joint was investigated. The results show that the typical interface structure of the joint is SiC/Cr23C6+Cu(s, s)+Si(s, s)/HEAF+Cu(s, s)/Cr23C6+Cu(s, s)+Si(s, s)/SiC. With the increase of brazing time, no change of types of phases occurred in the structure; the joint was still mainly composed of solid solution due to the high entropy effect, but the thickness of the reaction layer in the joint gradually increased. When the brazing time was 90 min, the thickness of the reaction layer reached a maximum of 25 μm. However, the stress generated during the cooling process of the over thick reaction layer joint was concentrated in the reaction layer and caused defects such as cracks in the reaction layer. When the welding temperature was 1 180℃ and the holding time was 60 min, the maximum joint shear strength reached 61 MPa. At this time, cracks started from the SiC ceramic of the extended joint, and then expanded in the direction of the joint, and finally ruptured at the interface between the ceramic and the reaction layer.

Key words: SiC ceramic, high-entropy filler, brazing, interfacial microstructure, mechanical property

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