二次法激光加工小孔技术

doi:10.7527/S1000-6893.2013.0362

材料工程与机械制造

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二次法激光加工小孔技术

张晓兵, 孙瑞峰

北京航空制造工程研究所高能束流加工技术重点实验室, 北京 100024

收稿日期:2013-05-30 修回日期:2013-08-15 出版日期:2014-03-25 发布日期:2013-08-21
通讯作者: 张晓兵，Tel.：010-85701580-601 E-mail：zxbxb@vip.sina.com E-mail:zxbxb@vip.sina.com
作者简介:张晓兵男，本科，研究员。主要研究方向：激光加工技术。Tel：010-85701580-601 E-mail：zxbxb@vip.sina.com；孙瑞峰男，博士研究生。主要研究方向：激光加工技术。Tel：010-85701580-601 E-mail：srf_1984@sina.com

Sequential Laser Drilling Technology

ZHANG Xiaobing, SUN Ruifeng

Science and Technology on Power Beam Processes Laboratory, Beijing Aeronautical Manufacturing Technology Research Institute, Beijing 100024, China

Received:2013-05-30 Revised:2013-08-15 Online:2014-03-25 Published:2013-08-21

摘要/Abstract

摘要：

为了提高激光加工航空发动机气膜冷却孔质量，介绍了一种采用焦耳级脉冲能量毫秒激光在镍基高温合金上快速加工初始通孔，再采用毫焦耳级脉冲能量纳秒激光扩孔的二次加工小孔方法。通过该方法试图消除毫秒激光加工小孔产生的再铸层以及解决纳秒激光直接加工几乎无再铸层小孔效率低、深度有限的问题，从而实现更高效率加工高质量气膜冷却孔。试验研究结果表明，该方法可以有效去除毫秒激光加工小孔孔壁的再铸层，改善孔壁表面质量，与纳秒激光直接加工小孔比较，在加工1 mm左右深的小孔时可以提高加工效率，但加工2 mm以上深度的小孔时，对提高加工效率的作用不明显。基于试验结果及分析，对二次法加工小孔提出了改进措施。

关键词: 激光, 制孔, 气膜冷却孔, 再铸层, 纳秒激光, 毫秒激光

Abstract:

This paper reports a new processing method that makes a hole rapidly with millisecond pulse laser in scale of joule pulse energy in nickel-based alloy at first, and enlarges the original hole with nanosecond pulse laser in scale of mJ pulse energy secondly for making higher quality cooling holes in aero-engine. In this way we attempt to eliminate the recast of holes made by millisecond pulse laser and resolve the problems of long processing time and limited processing depth caused by nanosecond pulse laser directly making holes with negligible recast,so making high quality holes with higher processing efficiency could be realized. The experimental results show that this method could remove the recast around the holes made by millisecond pulse laser effectively and improve the hole's inner surface quality; compared with nanosecond pulse laser making holes directly, it is effective in increasing the processing efficiency for holes of around 1 mm depth, but no apparent effect in shortening processing time in making holes of above 2 mm depth. Based on the research results and analysis, a few ideas for improving this kind of processing technique are proposed.

Key words: lasers, drilling, film-cooling hole, recast layer, nanosecond laser, millisecond laser

中图分类号:

V263
V261.8

张晓兵, 孙瑞峰. 二次法激光加工小孔技术[J]. 航空学报, 2014, 35(3): 894-901.

ZHANG Xiaobing, SUN Ruifeng. Sequential Laser Drilling Technology[J]. ACTA AERONAUTICAET ASTRONAUTICA SINICA, 2014, 35(3): 894-901.

参考文献

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E-mail：hkxb@buaa.edu.cn

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主管单位：中国科学技术协会主办单位：中国航空学会北京航空航天大学

二次法激光加工小孔技术

Sequential Laser Drilling Technology

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