收稿日期:2024-11-13
修回日期:2025-01-13
接受日期:2025-01-21
出版日期:2025-02-10
发布日期:2025-02-10
通讯作者:
于国强
E-mail:ygq@nuaa.edu.cn
基金资助:
Guoqiang YU1(
), Siyuan HAN1, Xiguang GAO1, Yingdong SONG1,2
Received:2024-11-13
Revised:2025-01-13
Accepted:2025-01-21
Online:2025-02-10
Published:2025-02-10
Contact:
Guoqiang YU
E-mail:ygq@nuaa.edu.cn
Supported by:摘要:
电阻抗层析成像技术(EIT)作为一种新兴的损伤监测技术,以其非侵入、响应快、设备结构简单等优势而被认为在航空航天结构健康监测领域具有极高的应用潜力。首先对电阻抗成像算法的发展历程进行回顾,总结了国内外近年来EIT在正问题模型、正则化、逆问题求解等方面所取得的代表性成果。接着对EIT针对航空航天领域中常用的树脂基复合材料,陶瓷基复合材料以及其他功能性材料的损伤监测应用情况进行了系统性的归纳,并总结了EIT技术现有的针对三维结构可行的电极阵列排布以及激励方案。最后指出了电阻抗层析成像技术现存的关键问题,并对其未来的发展方向做出展望。
中图分类号:
于国强, 韩思远, 高希光, 宋迎东. 电阻抗层析成像在航空航天结构健康监测领域的应用及发展展望[J]. 航空学报, 2025, 46(15): 231532.
Guoqiang YU, Siyuan HAN, Xiguang GAO, Yingdong SONG. Application and development prospects of electrical impedance imaging in aerospace structural health monitoring[J]. Acta Aeronautica et Astronautica Sinica, 2025, 46(15): 231532.
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