航空学报 > 2025, Vol. 46 Issue (10): 431555-431555   doi: 10.7527/S1000-6893.2025.31555

SiCf/SiC复合材料锥孔飞秒激光加工方法

李兆基, 董志刚, 杨峰, 鲍岩, 康仁科, 孙健淞()   

  1. 大连理工大学 高性能精密制造全国重点实验室,大连 116024
  • 收稿日期:2024-11-19 修回日期:2024-12-05 接受日期:2025-01-23 出版日期:2025-02-13 发布日期:1900-01-01
  • 通讯作者: 孙健淞 E-mail:sunjs@dlut.edu.cn
  • 基金资助:
    国家杰出青年科学基金(52325506)

Femtosecond laser processing method for conical holes in SiCf/SiC composites

Zhaoji LI, Zhigang DONG, Feng YANG, Yan BAO, Renke KANG, Jiansong SUN()   

  1. State Key Laboratory of High-performance Precision Manufacturing,Dalian University of Technology,Dalian 116024,China
  • Received:2024-11-19 Revised:2024-12-05 Accepted:2025-01-23 Online:2025-02-13 Published:1900-01-01
  • Contact: Jiansong SUN E-mail:sunjs@dlut.edu.cn
  • Supported by:
    National Natural Science Foundation for Distinguished Young Scholars of China(52325506)

摘要:

陶瓷基复合材料因其优异的机械性能和耐高温特性成为航空发动机热端构件的优选材料,由于其高硬度、高脆性、低导电性的材料特点,导致小孔径、大深径比、变截面结构的锥形气膜冷却孔加工成为难题,飞秒激光加工是解决该难题的有效方法。基于锥孔结构,设计了正螺旋轨迹和负螺旋轨迹,并采用倾斜激光束的两步旋切加工方法实现了SiCf/SiC复合材料上正锥孔和负锥孔的高质量加工。加工后锥孔出入口尺寸误差≤10 μm,锥度误差≤0.1°;入口边缘覆盖有少量沉积物,出口无沉积物,边缘锋利;正锥孔和负锥孔孔壁形貌均匀,可以观察到被平整去除的纤维和基体结构,孔壁粗糙度Sa分别为1.8 μm和2.5 μm左右。对锥孔的形成过程进行了研究,分析了孔底形貌、出入口尺寸的演变过程,阐明了锥孔的孔轮廓创成机制,为SiCf/SiC复合材料热端部件锥孔的高质量加工提供了工艺基础及质量评价参考。

关键词: 陶瓷基复合材料, 激光加工, 锥孔, 加工质量, 创成机制

Abstract:

Ceramic matrix composites stand out for excellent mechanical properties and high temperature resistance, making them promising for hot-end components of aircraft engines. However, due to their high hardness, brittleness, and low conductivity, processing conical film cooling holes with small aperture, large aspect ratio, and variable cross section has become a challenge. Femtosecond laser processing is an effective solution to this problem. Based on the conical hole structure, both positive and negative helical path were designed, and a two-step rotary drilling method using an inclined laser beam is adopted to achieve high-quality machining of positive and negative conical holes in SiCf/SiC composite materials. The dimensional error of the conical hole entrance and exit is ≤ 10 μm, and the taper error is ≤ 0.1°; the entrance edges were covered with a small amount of deposition, while the exit is free of deposition and has sharp edge. The wall morphology of both the positive and negative conical holes is uniform, with fibers and matrix structures uniformly removed. The surface roughness (Sa) of the hole walls is approximately 1.8 μm for the positive conical hole and 2.5 μm for the negative conical hole. The formation process of the conical holes is studied, and the evolution of the bottom morphology and entrance/exit dimensions is analyzed. The hole profile formation mechanism is clarified, providing a processing foundation and quality evaluation reference for high-quality machining of conical holes in SiCf/SiC composite hot-end components.

Key words: ceramic matrix composites, laser processing, conical hole, processing quality, formation mechanism

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