| [1] Wang W, Zhu D, Allen D M, et al. Non-traditional machining techniques for fabricating metal aerospace filters[J]. Chinese Journal of Aeronautics, 2008, 21(5): 441-447.[2] Datta M, Landolt D. Fundamental aspects and applications of electrochemical microfabrication[J]. Electrochimica Acta, 2000, 45(15): 2535-2558.[3] Bhattacharyya B, Munda J, Malapati M. Advancement in electrochemical micro-machining[J]. International Journal of Machine Tools and Manufacture, 2004, 44(15): 1577-1589.[4] Sen M H, Shan H S. A review of electrochemical macro-to micro-hole drilling processes[J]. International Journal of Machine Tools and Manufacture, 2005, 45(2): 137-152.[5] Kern P, Veh J, Michler J. New developments in through-mask electrochemical micromachining of titanium[J]. Journal of Micromechanics and Microengineering, 2007, 17(6): 1168.[6] Zhu D, Qu N S, Li H S. et al. Electrochemical micromachining of microstructures of micro hole and dimple array[J]. CIRP Annals-Manufacturing Technology, 2009, 58(1): 177-180.[7] Wang W, Zhu D, Qu N S, et al. Flow balance design and experimental investigation on electrochemical drilling of multiple holes[J]. Acta Aeronautica et Astronautic Sinica, 2010, 31(8): 1667-1673. (in Chinese) 王维, 朱荻, 曲宁松, 等. 群孔管电极电解加工均流设计及其试验研究[J]. 航空学报, 2010, 31(8): 1667-1673.[8] Mcgeoug J A, Leu M C, Rrjurkar K P, et al. Electroforming process and application to micro/macro manufacturing[J]. CIRP Annals-Manufacturing Technology, 2001,50(2): 499-514.[9] Ming P M, Li Y J, Wang Y L, et al. Fabrication of micro-precision sieves with high open area percentage using micro-electroforming method[J]. Electromachining & Mould, 2011(4): 43-46. (in Chinese) 明平美, 李英杰, 王艳丽, 等. 微细电铸法制造高开孔率精细网片[J]. 电加工与模具, 2011(4): 43-46.[10] Datta M, Romankiw L T. Application of chemical and electrochemical micromachining in the electronics industry[J]. Journal of the Electrochemical Society, 1989, 136(6): 285C-292C.[11] Datta M. Microfabrication by electrochemical metal removal[J]. IBM Journal of Research and Development, 1998, 42(5): 655-670.[12] Heidborn E. Process for manufacturing screens for centrifugals, particularly working screens for continuously operating sugar centrifugals: USA, US 4341603. 1982-07-27.[13] Wang L X, You Y F. Research progress in nickel screen[J]. Printing and Dyeing, 2003, 29(9): 47-48. (in Chinese) 王立新, 游元峰. 印花镍网的进展[J]. 印染, 2003, 29(9): 47-48.[14] Ming P M, Lv Z B, Li H G, et al. A method of fabrication micro-perforatiion array with double tapered openings: China, 201210233224.8. 2012-07-06. (in Chinese) 明平美, 吕珍斌, 李红光, 等. 一种双面外扩形金属微小孔阵列加工方法: 中国, 201210233224.8. 2012-07-06.[15] Hu Y Y, Zhu D, Li H S. Fabrication of metal micro hole array by using over-plating technology[J]. Optics and Precision Engineering, 2010, 18(8):1793-1800. (in Chinese) 胡洋洋, 朱荻, 李寒松. 采用过电铸工艺制造金属微细阵列网板[J]. 光学与精密工程, 2010, 18(8): 1793-1800.[16] West A C, Madore C, Matlosz M, et al. Shape changes during through-mask electrochemical micromachining of thin metal films[J]. Journal of the Electrochemical Society, 1992, 139(2): 499-506.[17] Datta M. Fabrication of an array of precision nozzles by through-mask electrochemical micromachining[J]. Journal of the Electrochemical Society, 1995, 142(11): 3801-3805.[18] Shenoy R V, Datta M. Effect of mask wall angle on shape evolution during through-mask electrochemical micromachining[J]. Journal of the Electrochemical Society, 1996, 143(2): 544-549.[19] Shenoy R V, Datta M, Romankiw L T. Investigation of island formation during through-mask electrochemical micromachining[J]. Journal of the Electrochemical Society, 1996, 143(7): 2305-2309.[20] Li D L, Zhu D, Li H S, et al. Effects of mask wall angle on matrix-hole shape changes during electrochemical machining by mask[J]. Journal of Central South University of Technology, 2011, 18(4): 1115-1120.[21] Li D L, Zhu D, Li H S. Microstructure of electrochemical micromachining using inert metal mask[J]. The International Journal of Advanced Manufacturing Technology, 2011, 55(1-4): 189-194. |
.jpg){kind=small}
”形喇叭孔。基于优化的惰性金属模板，能电铸-电解组合加工出出入口廓形对称性好的、最小孔径比被复制模板孔小的、网片厚度大且表面光滑的双向喇叭形金属微小孔阵列，其进出口的对称度、孔径偏差与出口相对于最小孔径的扩口率等分别为88.8%、9.7%和110.1%。
CJA
