航空学报 > 2001, Vol. 22 Issue (5): 429-433

利用金刚石微颗粒进行微米级加工的研究

王凯建   

  1. 北京大学力学与工程科学系 北京 100871
  • 收稿日期:2000-09-01 修回日期:2000-11-24 出版日期:2001-10-25 发布日期:2001-10-25

ULTRA-SMALL SCALE GRINDING WITH DIAMOND ELECTRIC PLATING TOOL (HELICAL-FEED DRILLING MECHANICAL GRINDING METHOD)

WANG Kai-jian   

  1. Department of Mechanics and Engineering Science, Peking University, Beijing 100871, China
  • Received:2000-09-01 Revised:2000-11-24 Online:2001-10-25 Published:2001-10-25

摘要:

为确立用金刚石微颗粒对硬脆性材料进行微加工的技术基础,在进行了螺旋切入方式的运动学和力学模式的解析后,对用金刚石微颗粒进行磨削微加工的最佳条件进行了探讨。在此基础之上,用电镀有金刚石微颗粒的工具和螺旋切入磨削方式,成功地实现了对玻璃、硅片等各种各样的硬脆性材料的100μm尺度的高精度加工。

关键词: 金刚石微颗粒, 螺旋切入, 磨削, 微加工, 硬脆性材料

Abstract:

For establishing the basic technology of micro manufacture with diamond grains on hard and brittle materials, this paper studied the optimization condition of the ultra small scale grinding with diamond electric plating tool through analyzing the kinematics and mechanics model of the helical feed drilling mechanical grinding method. Following the analyzes, the author successfully realized the high precision micro manufacture with the diamond electric plating tool and the helical feed drilling mechanical grinding method on glasses, silicon and so on.

Key words: diamo nd gr ain, helical-feed dr illing metho d, g rinding, ultr a-small scale manufacture, har d andbrittle materials