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ACTA AERONAUTICAET ASTRONAUTICA SINICA ›› 2015, Vol. 36 ›› Issue (7): 2468-2474.doi: 10.7527/S1000-6893.2014.0304

• Material Engineering and Mechanical Manufacturing • Previous Articles     Next Articles

Manufacturing process and mechanical performance before and after aging treatment of embedded co-cured high- temperature-resistance damping composite

ZHANG Qian1, LIANG Sen1, LIANG Tianxi2   

  1. 1. School of Mechanical Engineering, Qingdao Technological University, Qingdao 266033, China;
    2. China Academy of Engineering Physics, Mianyang 621900, China
  • Received:2014-07-09 Revised:2014-10-31 Online:2015-07-15 Published:2014-11-14
  • Supported by:

    National Natural Science Foundation of China (51375248); The Project of China Academy of Engineering Physics: Design and Development of Instrument Panel

Abstract:

The high-temperature-resistance property of the embedded co-cured damping composite is very important to its application in special environment. A new high-temperature-resistance ingredient of viscoelastic damping material is found through orthogonal experimental method to be co-cured with high-temperature-resistance composite preperg (T700/QY260). Damping material is dissolved in tetrahydrofuran to form viscoelastic material solution and then it is used to produce damping membrane on the composite preperg by brush coating process. After the composite preperg with damping membrane is laid according to the design requirement, the autoclave is employed to make the embedded co-cured high-temperature-resistance damping composite specimens. The interlaminar bonding force between the damping layer and composite is tested before and after high-temperature aging to study the high-temperature resistant performance of this embedded co-cured damping composite. The results show that the composite material has good high-temperature-resistance performance and it would provide a possibility for the wide application of embedded co-cured high-temperature-resistance damping composite.

Key words: damping, composite, embedded, high-temperature-resistance, bonding

CLC Number: