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ACTA AERONAUTICAET ASTRONAUTICA SINICA ›› 2014, Vol. 35 ›› Issue (12): 3324-3330.doi: 10.7527/S1000-6893.2014.0009

• Solid Mechanics and Vehicle Conceptual Design • Previous Articles     Next Articles

Axisymmetric Plain Strain Analysis of Stress and Deformation Mode for Foam/Rubber Adapter

ZHONG Jianlin1, MA Dawei1, LI Shijun2, REN Jie1, HU Jianguo1   

  1. 1. School of Mechanical Engineering, Nanjing University of Science and Technology, Nanjing 210094, China;
    2. 713th Research Institute of China Shipbuilding Industry Corporation, Zhengzhou 450015, China
  • Received:2013-12-24 Revised:2014-03-03 Online:2014-12-25 Published:2014-03-28
  • Supported by:

    National Natural Science Foundation of China (51303081); Graduate Student Research and Innovation Program of Jiangsu Province (KYLX_0398)

Abstract:

The analytical method of stress and deformation mode for foam/rubber adapter is an important premise for mechanical theory research of the adapter. Based on the axisymmetric plain strain assumption, the analytical formulas of the radial stress, tangential stress, and radial displacement for the foam and rubber hollow cylinders are derived. A set of nonlinear ordinary differential analytical equations for the adapter compression problem under displacement boundary conditions are built and the correctness of the analytical formulas is verified by the simulation of the numerical model. The radius of the foam/rubber bonding surface is changed and the influence on the adapter compression characteristic brought by the thickness ratio of the foam layer is researched. The results show that the calculation results of the numerical model and analytical formulas are basically the same; the radial stress and the tangential stress of the adapter foam layer differ little in value; the tangential stress is higher than the radial stress by an order of magnitude in the rubber layer; the maximum radial stress locates on the outer surface of the adapter and the maximum tangential stress and radial displacement locate on the foam/rubber bonding surface; and with the increase of the foam layer thickness ratio, the stress and displacement of the adapter decrease and the decrement decreases.

Key words: adapter, foam/rubber hollow cylinder, strain energy function, constitutive model, deformation mode

CLC Number: