Abstract:

A composite based on linear polyamide acid and thermosetting polyimide is prepared. After curing a semiinterpenetrating polymer network (SemiIPN) structure is formed which combined the toughness and the heat resistance of both. The polyamide acid is synthesized by 3,3′,4,4′Benzophenonetetracarboxylic dianhydride (BTDA) and 4,4′Diaminodiphenylether (ODA). And with nadic anhydride as terminate thermosetting polyimide is prepared by the same monomer. The polyimides are characterized by IR, DSC and TGA, the linear polyimide (PI) does not show appreciable decomposition up to 600℃ and the film after cuing has good toughness.The cuing temperature of thermosetting PI is 350℃ which is detected by DSC,and peak value moves to high temperature with the increasing of molecular weight,the result by TGA shows that the temperature of decomposition is about 483℃.Blending of the two adhesives results in a new adhesive with good bonding strength and heat durability.

Key words: condensation , type , linear , PI,  , nadic , anhydrideterminated , thermosetting , PI,  , adhesive,  , high , temperature , resistance,  , heat , aging