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Acta Aeronautica et Astronautica Sinica ›› 2025, Vol. 46 ›› Issue (22): 431642.doi: 10.7527/S1000-6893.2025.31642

• Material Engineering and Mechanical Manufacturing • Previous Articles    

Quasi-in situ electron backscatter diffraction tensile test on deformation mechanisms of laser melting deposited Ti-3Cu alloy

Lihong JIANG(), Lin ZHU, Zheng LIU   

  1. Jiangxi Provincial Key Laboratory of High-End Equipment Extreme Manufacturing Technology,Nanchang Hangkong University,Nanchang 330063,China
  • Received:2024-12-09 Revised:2025-02-24 Accepted:2025-05-12 Online:2025-06-11 Published:2025-06-10
  • Contact: Lihong JIANG E-mail:jianglihong1027@126.com
  • Supported by:
    National Natural Science Foundation of China(52465045)

Abstract:

Ti-Cu alloys exhibit excellent mechanical properties and corrosion resistance, making them promising candidates for biomedical and aerospace engineering applications. However, their deformation mechanisms remain poorly understood. Quasi-in situ tensile testing combined with Electron Backscatter Diffraction (EBSD) was employed to investigate the microstructural evolution of a Laser Melting Deposited (LMD) Ti-3Cu alloy fabricated via in situ alloying during room-temperature tensile deformation. The results demonstrated heterogeneous orientation rotations within localized regions of individual grains. Dislocations were primarily concentrated at grain and subgrain boundaries, accompanied by a progressive increase in the fraction of Low-Angle Grain Boundaries (LAGBs, 2°-15°) with increasing strain. Analysis of localized grain evolution revealed that α-grains with distinct crystallographic orientations and morphologies underwent non-uniform deformation, where macroscopic strain was accommodated through grain rotation and substructure formation. Quantitative Schmid factor analysis combined with slip trace characterization confirmed the dominance of the prismatic slip system in the Ti-3Cu alloy. These findings provide critical insights into the deformation mechanisms of laser-melting-deposited Ti-Cu alloys, offering guidance for their fabrication and application in advanced technologies.

Key words: Ti-3Cu alloy, Laser Melting Deposition (LMD), Electron Backscatter Diffraction (EBSD), in situ tensile test, deformation mechanism

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