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ACTA AERONAUTICAET ASTRONAUTICA SINICA ›› 2017, Vol. 38 ›› Issue (7): 220553-220553.doi: 10.7527/S1000-6893.2017.220553

• Solid Mechanics and Vehicle Conceptual Design • Previous Articles     Next Articles

Vibration mode evolution of 2D woven C/SiC composite panels in hot environment

HE Erming, CHEN Bing, CAO Cunxian   

  1. School of Aeronautics, Northwestern Polytechnical University, Xi'an 710072, China
  • Received:2016-06-22 Revised:2016-10-19 Online:2017-07-15 Published:2017-04-01
  • Supported by:

    National Natural Science Foundation of China (51675426);Aerospace Science and Technology Innovation Fund (2014KC010043)

Abstract:

To study the law of the variation of natural vibration frequencies of 2D woven C/SiC composite panels in hot environment, and further reveal the mode jumping and losing phenomena in the thermal mode test, the mechanics modules, thermal expansion coefficient and thermal conductivity of 2D woven C/SiC composite panels after homogenization are calculated by volume-averaged method based on its microscopic mechanics model. The vibration mode evolutions of the simply-supported rectangular panel under uniform temperature loads and linear non-uniform temperature loads are studied based on the macroscopic material properties obtained above, and the relationships between high temperature and the natural frequency, mode shapes are obtained from the mode analysis. The research results show that under the uniform temperature loads, when we consider only the effect of temperature on the elastic modulus, the natural frequency decrease slightly as the temperature increases. When the thermal stress caused by high temperature is considered separately, it is found that the natural frequency increases after the critical buckled temperature, and as the temperature increases, the mode shape being staggered which results in some mode shapes appear early, in other words, mode jumping occurs in those moments. If both of the two factors are considered, the natural frequency will be smaller at each temperature compared with only considering the thermal stress caused by high temperature. However, the trends are similar. Under the non-uniform high temperature loads, it shows that some modal shapes may be lost by comparing the mode shapes under different operating conditions, and the loss is not messy, but goes from low-order to high-order frequency.

Key words: 2D C/SiC, composite panel, thermal mode, natural frequency, mode jumping and losing phenomenna

CLC Number: