Abstract: A thermal excited silicon resonant pressure microsensor whose preliminary sensing unit is a square silicon diaphragm, and the final sensing unit is a silicon beam resonator, was investigated systematically A mathematical model of the above sensing structure was established in engineering Based on the above model and theoretical analyzing results, the principle sample of the above sensing structure was designed and manufactured by using the micro mechanical technology The parameters of the sensing structure are as follows: length 4 mm,thickness 0 1 mm,for the diaphragm; length 1 3 mm,width 0 08 mm and thickness 0 007 mm for the beam resonator The open loop tests for the resonator of the sensor were carried out with the thermal resistance exciter and piezo resistance detector

Key words: resonant sensor, silicon micr ostr ucture, pr essur e sensor