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ACTA AERONAUTICAET ASTRONAUTICA SINICA ›› 2005, Vol. 26 ›› Issue (5): 610-616.

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Rheological Behaviors and Viscosity Model of Bisphnol-A Epoxy/DDS Resin System

SHI Feng1, DUAN Yue-xin1, ZENG Xiu-ni1, LIANG Zhi-yong1,2, ZHANG Zuo-guang1   

  1. 1. Faculty 104, School of Material Science and Engineering, Beijing University of Aeronautics and Astronautics, Beijing 100083, China;2. Florida Advanced Center for Composite Technologies, AMU-FSU College of Engineering, Tallahassee, FL 32310-6046, USA
  • Received:2005-01-20 Revised:2005-06-08 Online:2005-10-25 Published:2005-10-25

Abstract:

The effects of DDS curing agent ratio on the curing kinetic and viscosity of a DDS/bisphnol-A epoxy resin system are experimentally studied by DSC analysis and viscosity measurements. The results show that the DDS ratio has little effect on rheological behavior of resin system in a certain range. An engineering viscosity model is succefully developed to predict resin rheological behaviors of the resin system based on the viscosity measurement results and mechanisms of the curing reaction. The established model can be used to predict the processing windows of different viscosity requirements, which is critical for the simulation and optimization of composite manufacturing processes.

Key words: bisphnol-A epoxy resin, reaction curing agent, viscosity model, processing windows

CLC Number: