ACTA AERONAUTICAET ASTRONAUTICA SINICA >
Fabrication of Through Hole Array with Double Tapered Openings Using Electroforming and Mask Electrochemical Micromachining
Received date: 2013-07-29
Revised date: 2013-09-16
Online published: 2013-09-29
Supported by
National Natural Science Foundation of China (51175152); Key Technologies R & D Program of Henan Province (092102210357)
Basing on an inert perforation metal plate, a hybrid electrochemical fabrication approach combining electroforming and mask electrochemical micromachining is proposed to manufacture efficiently metal through hole arrays with double tapered openings. The feasibility of this approach is first investigated numerically according to the developed numerical models, and then the effect of pattern parameters of the inert metal plate used in the hybrid fabrication on the geometrical characteristics of the through hole array to be machined is numerically analyzed. Furthermore, optimal pattern parameters are determined. Experimental results agree with numerical analysis on the whole. Research results show that, the geometrical characteristics of the shaped through hole array are to a great extent dependent on the pattern parameters of the inert metal plate used. Smaller through holes with better opening contour symmetry can be achieved if a thicker inert metal plate with a bigger mask wall angle is used. With the reduction of the rib-width of the inter metal perforation plate, the depth, minimum diameter and opening contour symmetry of the machined hole become better. With the increase of perforation of the inert plate, the limiting thickness of the machined through hole plate becomes bigger, but the minimum diameter gets smaller and the opening contour symmetry worse. In addition, inward horned-shaped contour in one or two openings can be easily shaped electrochemically when the inert perforation metal plate with a narrow rib and a small mask wall angle is utilized. With a diameter deviation of 9.7% between the inlet and outlet opening, and an expanding rate of 110.1%, a favorable through hole array can be fabricated with good opening contour symmetry (88.8%), fine holes with diameters smaller than the plate perforation copied, and smooth surfaces by using the hybrid electrochemical fabrication method.
MING Pingmei , BAO Xiaohui , HAO Qiaoling , WANG Juntao . Fabrication of Through Hole Array with Double Tapered Openings Using Electroforming and Mask Electrochemical Micromachining[J]. ACTA AERONAUTICAET ASTRONAUTICA SINICA, 2014 , 35(7) : 2049 -2062 . DOI: 10.7527/S1000-6893.2013.0394
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