在低温下实现了嵌入式阻尼复合材料的共固化，且共固化层合板具有良好的层间结合性能。通过正交试验研制出一种能够与玻璃纤维/酚醛树脂预浸料在80℃时共固化且力学性能优良的黏弹性材料组分。探索使用强极性的四氢呋喃作为溶剂将黏弹性阻尼材料溶解为阻尼胶浆，然后用刷涂工艺制作带阻尼薄膜的预浸料，最终按照预定的铺层经过共固化工艺制备出嵌入式低温共固化复合材料试件。自由衰减试验及层间剪切试验获得了阻尼性能及剪切性能随阻尼层厚度的变化规律曲线，实验数据表明：随着阻尼层厚度增大，复合材料结构的阻尼系数变大，层间剪切应力逐渐减小。
The co-curing of embedded damping composites is achieved at low temperatures, and the co-cured laminates possessed superior interlayer bonding property. An orthogonal test is implemented to develop a viscoelastic material ingredient capable of co-curing with fiberglass/phenolic resin prepreg at 80℃, obtaining excellent mechanical properties. The strong polar tetrahydrofuran is employed as a solvent to dissolve the viscoelastic damping material into damping paste, then the prepreg with damping film is manufactured using the brushing coating process. Finally, based on the scheduled layup sequence, the embedded low-temperature co-cured composite specimens are prepared through the co-curing process. The curves of the damping and shear properties with respect to damping layer thickness were obtained through free decay test and interlaminar shear test. The experimental data indicated that the thicker the damping film, the larger the composite structure damping coefficient, and the lower the interlaminar shear stress.
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