材料工程与机械制造

面向自动铺放的预浸料动态黏性实验研究

  • 陆楠楠 ,
  • 肖军 ,
  • 齐俊伟 ,
  • 肖健 ,
  • 黄晓川
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  • 南京航空航天大学 材料科学与技术学院, 江苏 南京 210016
陆楠楠 女,硕士研究生。主要研究方向:复合材料自动化成型工艺。Tel:025-84892980 E-mail:lnn897550668@163.com;肖军 男,硕士,教授,博士生导师。主要研究方向:先进复合材料设计、制造及自动化装备技术研究。Tel:025-84892980 E-mail:j.xiao@nuaa.edu.cn

收稿日期: 2013-05-09

  修回日期: 2013-08-01

  网络出版日期: 2013-08-28

基金资助

国家“973”计划(2014CB046501)

Experimental Research on Prepreg Dynamic Tack Based on Automated Placement Process

  • LU Nannan ,
  • XIAO Jun ,
  • QI Junwei ,
  • XIAO Jian ,
  • HUANG Xiaochuan
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  • College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China

Received date: 2013-05-09

  Revised date: 2013-08-01

  Online published: 2013-08-28

Supported by

National Basic Research Program of China (2014CB046501)

摘要

为解决自动铺放过程中预浸料铺贴适宜性问题,以预浸料对模具黏附性及预浸料自身黏附性为考察对象,试制了一套基于剥离实验的动态黏性测试装置,并结合本装置对剥离实验机理加以分析。采用固定其中2种参数,考察第3种参数法研究压力和温度对预浸料与模具及自身黏附性行为的影响。结果表明,2种模式下随着压力的增大,动态刚度值和黏性值均增大;随着温度的升高,动态刚度值降低,黏性值先增大后降低。该研究结果为后续自动铺放工艺研究奠定了理论基础。

本文引用格式

陆楠楠 , 肖军 , 齐俊伟 , 肖健 , 黄晓川 . 面向自动铺放的预浸料动态黏性实验研究[J]. 航空学报, 2014 , 35(1) : 279 -286 . DOI: 10.7527/S1000-6893.2013.0370

Abstract

This paper introduces a set of dynamic tack test equipment based on peel tests, and investigates the adhesion of the prepreg bonding on a rigid mould and with itself, in an attempt to study the bonding suitability of adjacent plies in an automated placement process. The mechanism of the peel test is explained in combination with the equipment. Two parameters are fixed and the third is investigated in the experiment; the method is so designed as to explore the adhesion of the prepreg bonding on the rigid mould and with itself in different pressures and temperatures. The results indicate that the dynamic stiffness and tack increases with the increase of pressure, while the dynamic stiffness decreases but the tack increases initially and then decreases with the increase of temperature in the two modes. This study provides a theoretical foundation for subsequent study of automated placement process.

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