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ACTA AERONAUTICAET ASTRONAUTICA SINICA ›› 1987, Vol. 6 ›› Issue (6): 309-313.

• 论文 • Previous Articles     Next Articles

TEMPERATURE COEFFICIENT OF ELECTRICAL RESISTANCE AND STABILITY OF AMORPHOUS Ni-Si-B ALLOY FILMS

Cheng Xianan,Wang Xuwei,Gu Qihua, Tang Zesun   

  1. Beijing Institute of Aeronautics and Astronautics
  • Received:1986-07-15 Revised:1900-01-01 Online:1987-06-25 Published:1987-06-25

Abstract: This paper presents the studies of electrical sheet resistance (R,Resistance per square area of the film and its temperature coefficient (TCR) and also the relation between R and TCR of the amorphous Ni-Si-B in the temperature range from 50 to 360℃ The relaxation activation energy (Ea) is calculated utilizing the slope ratio method Thq experimental results show that TCRs have the smallest value ± (10-610-5)K-1, when Rs are between 80 to 550 ohm/square-area(Ω/□) Films in thisr range of Rs have better stability and highEa TCRs of the films with R<80 Ω/□ are all positive, TCRs of those withRs>550 Ω/□ are all negative the larger the Rs the greater the absolute value of its TCR, and the smaller the Ea.