航空学报 > 2004, Vol. 25 Issue (3): 312-316

复合材料热压成型过程环氧树脂流变特性研究

张佐光1, 扎姆阿茹娜1, 任骞1, 陈纯2   

  1. 1. 北京航空航天大学材料科学与工程学院, 北京 100083;2. 北京玻璃钢研究设计院, 北京 102101
  • 收稿日期:2003-05-07 修回日期:2003-12-01 出版日期:2004-06-25 发布日期:2004-06-25

Research on Rheology Regularity of Epoxy Resin During Composite Press Molding Process

ZHANG Zuo-guang1, ZHAMU Aruna1, REN Qian1, CHEN Chun2   

  1. 1. College of Materials Science and Engineering, Beijing University of Aeronautics and Astronautics, Beijing 100083, China;2. Beijing Research and Design Institute of Glass Composites, Beijing 102101, China
  • Received:2003-05-07 Revised:2003-12-01 Online:2004-06-25 Published:2004-06-25

摘要: 针对复合材料热压成型过程的工艺特点,以环氧618/2E4MZ及环氧618/DDS体系为研究对象,通过测试DSC曲线、η T曲线、η γ曲线及计算不同升温速率下的流动活化能,得到温度、升温速率、剪切速率对体系黏度的影响规律。在大量实验研究基础上,利用具有可操作性的固化工艺参数(dT/dt)表征了阿累尼乌斯方程中的流动活化能、指前因子及幂律方程中的黏度系数,确定了两种树脂体系黏度平台区、下降区的黏度方程。当树脂体系一定时,所建立的黏度方程描述了树脂黏度下降区及黏度平台区的黏度变化规律,为复合材料热压成型树脂流变过程的模拟研究提供了参考依据。

关键词: 复合材料, 流变规律, 热压成型, 环氧树脂

Abstract: This paper is mainly about the resin matrix rheology regularity during the composite curing process. The bisphenol epoxy resin is used as the research object, and its DSC curve, viscosity-temperature curve and viscosity-rate curve are measured, the rheology activation energy is worked out, and then the regularities of the effects of temperature, temperature increase rate and shear rate are analyzed. Base on a lot of experiments, the rheology activation energy, exponential parameter of the Arrhenius equation and the viscosity parameter of the Power equation were expressed by temperature increase rate, and the viscosity equations of two resin system are established. With a definite resin system, these numerical models have a certain extent commonality for different curing processes.

Key words: composite, rheology regularity, press molding, epoxy resin