嵌入式中温共固化复合材料阻尼结构制作工艺及层间结合性能
张忠胜, 梁森
Manufacturing Process and Interlaminar Bonding Property of Embedded Medium-temperature Co-cured Composite Material Damping Structure
ZHANG Zhongsheng, LIANG Sen
航空学报
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2013, (8): 1972
-1979
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DOI: 10.7527/S1000-6893.2013.0069
CJA