电阻抗成像技术(Electrical Impedance Tomography, EIT)作为一种新兴的损伤监测技术，以其非侵入、响应快、设备结构简单等优势而被认为在航空航天结构健康监测领域具有极高的应用潜力。首先对电阻抗成像算法的发展历程进行回顾，总结了国内外近年来EIT在正问题模型、正则化、逆问题求解等方面所取得的代表性成果。接着对EIT针对航空航天领域中常用的树脂基复合材料，陶瓷基复合材料以及其他功能性材料的损伤监测应用情况进行了系统性的归纳，并总结了EIT技术现有的针对三维结构可行的电极阵列排布以及激励方案。最后指出了电阻抗层析成像技术现存的关键问题，并对其未来的发展方向做出展望。

Electrical impedance imaging technology (EIT), as an emerging damage monitoring technique, is deemed highly promising in aerospace structural health monitoring, owing to its non-invasive nature, rapid response, and simple equipment setup. This article first reviews the developmental history of electrical impedance tomography algorithms and summarizes the significant achievements made in recent years, both domestically and internationally, in for-ward problem modeling, regularization, and inverse problem solving. Then, a systematic summary was conducted on the damage monitoring applications of EIT technology for resin-based, ceramic-based, and other functional ma-terials commonly used in the aerospace field. The existing feasible electrode array arrangements and excitation schemes for three-dimensional structures using EIT technology were also summarized. Finally, the existing tech-nical problems of electrical impedance tomography technology were pointed out, and the future development direc-tion was discussed.