随着航空技术的快速发展，机载电子器件的集成度越来越高，传统的单相冷却技术难以满足其日益严峻的散热需求。为此，本文提出了一种耦合微通道热沉和喷雾冷却模块的新型高效冷却技术，并搭建了模拟高空低压环境的大功率开式闪蒸实验系统，探究了热流体的入口过热度和工质种类对换热性能的影响规律。研究结果表明：降低环境压力和提高热流体的入口温度均可增大热流体的入口过热度，从而达到强化换热和提高工质利用率的目的，但是二者的作用机制有所不同；工质物性是影响流动与换热特性的重要因素之一，当热流体为水时，换热量最高可达3326 W，对应的相变率为30.84 %，功耗比为456, 而当热流体为65#冷却液时，换热性能显著下降，换热量和相变率相较于水均降低了约18%，功耗比降低了约53%，主要原因在于65#冷却液具有较高的动力粘度和较低的导热系数，导致流动和换热特性同时恶化。本研究可为机载大功率电子器件高效热管理系统的设计和性能优化提供理论依据。
With the rapid advancement of aviation technology, the airborne electronic devices have been increasingly integrated, making traditional single-phase cooling technologies insufficient to meet the increasingly demanding heat dissipation requirements. To address this, this study proposes a new and efficient cooling technology that couples microchannel heat sinks with a spray cooling module. A high-power open flash evaporation experimental system simulating high-altitude low-pressure environments was built to explore the effects of the inlet superheat of the hot-side fluid and the type of working fluid on heat transfer performance. The study results indicate that reducing environmental pressure and increasing the inlet temperature of the hot-side fluid can both increase the inlet superheat of the hot-side fluid, thereby enhancing heat transfer and improving working fluid utilization. However, the mechanisms of these effects differ. The physical properties of the working fluid are crucial factors affecting flow and heat transfer characteristics. When water is used as the hot-side fluid, the heat transfer rate can reach up to 3326 W, with a vaporization ratio of 30.84% and a power consumption ratio of 456. In contrast, when 65# coolant is used as the hot-side fluid, the heat transfer performance significantly decreases, with the heat transfer rate and vaporization ratio both reducing by about 18% compared to water, and the power consumption ratio reducing by around 53%. The main reason for this is that 65# coolant has a higher dynamic viscosity and a lower thermal conductivity, leading to deteriorated flow and heat transfer characteristics. This study could provide a theoretical basis for the design and performance optimization of efficient thermal management systems for high-power airborne electronic devices.
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