材料工程与机械制造

嵌入式中温共固化复合材料阻尼结构制作工艺及层间结合性能

  • 张忠胜 ,
  • 梁森
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  • 青岛理工大学 机械工程学院, 山东 青岛 266033
张忠胜 男,硕士研究生。主要研究方向:结构动力学。Tel:0532-85071299 E-mail:zshengzhang@gmail.com;梁森 男,博士,教授,博士生导师。主要研究方向:复合材料动力学设计。Tel:0532-85071299 E-mail:liangsen98@mailst.xjtu.edu.cn

收稿日期: 2012-10-08

  修回日期: 2013-01-08

  网络出版日期: 2013-01-23

基金资助

国家自然科学基金(50875135);山东省自然科学基金(Z2007F04)

Manufacturing Process and Interlaminar Bonding Property of Embedded Medium-temperature Co-cured Composite Material Damping Structure

  • ZHANG Zhongsheng ,
  • LIANG Sen
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  • College of Mechanical Engineering, Qingdao Technological University, Qingdao 266033, China

Received date: 2012-10-08

  Revised date: 2013-01-08

  Online published: 2013-01-23

Supported by

National Natural Science Foundation of China (50875135);Natural Science Foundation of Shandong Province (Z2007F04)

摘要

嵌入式共固化复合材料阻尼结构层间易脱层问题的解决对这种新型阻尼结构的应用来说至关重要。本文根据中温固化玻璃纤维/环氧树脂复合材料固化工艺参数,提出用正交实验法研究嵌入复合材料层中的粘弹性阻尼薄膜的组分,探索用刷涂工艺在预浸料表面刷涂不同厚度的阻尼薄膜,然后利用固化工艺制作嵌入式共固化复合材料试件,最后通过阻尼层剪切实验, 获得阻尼薄膜厚度与层间最大剪切应力的变化曲线。失效界面分析说明刷涂工艺制成的阻尼薄膜与玻璃纤维/环氧树脂预浸料共固化反应后在层间形成互穿网络结构(IPN)和物理融合,这使得嵌入式共固化复合材料具有更好的层间结合性能。

本文引用格式

张忠胜 , 梁森 . 嵌入式中温共固化复合材料阻尼结构制作工艺及层间结合性能[J]. 航空学报, 2013 , 34(8) : 1972 -1979 . DOI: 10.7527/S1000-6893.2013.0069

Abstract

The solution to the delamination of an embedded co-cured composite material damping structure is critical for the application of the new damping structure. In this paper an orthogonal experiment method is proposed to investigate the ingredients of a viscoelastic damping material embedded in a composite material. The brush coating process is employed to coat the damping material films with various thicknesses on the surface of a composite prepreg. After the specimens of the embedded co-cured composite damping structure are manufactured according to the curing process parameters of glass fiber/epoxy composites, the interlamination shear measurements are completed. A curve of the maximum interlamination shear stress with respect to damping film thickness is obtained. At the same time the effect of damping layer thickness on the shear property is studied in detail. The shear failure analysis indicates that Interpenetrating Polymer Network (IPN) structures and physical mixture are formed during the co-curing reaction and this structure enables the embedded co-cured composite to possess an excellent interlamination bonding property.

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