1 |
ALLRED R J, FURSE C. Reflection budgeting methodology for high-speed serial link signal integrity design[J]. Progress in Electromagnetics Research B, 2021, 91(1): 59-77.
|
2 |
孔繁, 盛卫星, 马晓峰, 等. 高速背板互连的信号完整性仿真方法[J]. 系统工程与电子技术, 2014, 36(10): 2082-2088.
|
|
KONG F, SHENG W X, MA X F, et al. Signal integrity simulation method for high-speed backplane interconnection[J]. Systems Engineering and Electronics, 2014, 36(10): 2082-2088 (in Chinese).
|
3 |
王小辉, 朱丽, 车程, 等. 电气线路互联系统安全性设计与分析方法研究[J]. 西北工业大学学报, 2022, 40(3): 690-698.
|
|
WANG X H, ZHU L, CHE C, et al. Study on safety design and analysis method for electrical wiring interconnection system[J]. Journal of Northwestern Polytechnical University, 2022, 40(3): 690-698 (in Chinese).
|
4 |
张荷爽. 10 Gbps高速连接器的仿真、测试及优化[D]. 北京: 北京邮电大学, 2019: 13-15.
|
|
ZHANG H S. Simulation, test, and optimization of 10 Gbps high speed connector[D]. Beijing: Beijing University of Posts and Telecommunications, 2019: 13-15 (in Chinese).
|
5 |
KIM H, KIM J J, PARK J, et al. High-frequency modeling and signal integrity analysis of a silicone rubber socket for high-performance package[J]. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2017, 7(8): 1356-1368.
|
6 |
BILAL H M, WANG Z R, GAO J C, et al. Impact of receptacle degradation and loose connection on signal integrity and electrical performance repeatability[J]. IET Circuits, Devices & Systems, 2020, 14(7): 1012-1017.
|
7 |
段红玉. 四同轴高速连接器信号完整性分析[D]. 天津: 河北工业大学, 2022: 16-18.
|
|
DUAN H Y. Signal integrity analysis of the quadrax high-speed connector [D].Tianjin: Hebei University of Technology, 2022: 16-18. (in Chinese)
|
8 |
于争. 信号完整性揭秘: 于博士SI设计手记[M]. 北京: 机械工业出版社, 2013.
|
|
YU Z. Secret of signal integrity: Notes on Dr. Yu’s design notes[M]. Beijing: China Machine Press, 2013 (in Chinese).
|
9 |
ZHOU X L, LI L, LU B H, et al. Effects of the damage layer on connection loss of fiber-optic connectors[J]. Optical Fiber Technology, 2018, 46(12): 137-140.
|
10 |
WANG Z R, GAO J C, FLOWERS G T, et al. Modeling and analysis of signal integrity of high-speed interconnected channel with degraded contact surface[J]. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2019, 9(11): 2227-2236.
|
11 |
尹治宇. Mini SAS连接器的信号完整性分析[D]. 成都: 电子科技大学, 2016: 22-24.
|
|
YIN Z Y. Signal integrity analysis of Mini SAS connector[D].Chengdu: University of Electronic Science and Technology of China, 2016: 22-24. (in Chinese)
|
12 |
张志远. SAS硬盘连接器的信号完整性分析与研究[D]. 成都: 电子科技大学, 2017: 32-52.
|
|
ZHANG Z Y. Analysis and research on signal integrity of SAS hard disk connector[D].Chengdu: University of Electronic Science and Technology of China, 2017: 32-52. (in Chinese)
|
13 |
WU B P. Micro-cables out of high-speed communication chip through embedded wires in the package substrate[C]∥ 2018 IEEE CPMT Symposium Japan (ICSJ). Piscataway: IEEE Press, 2018: 109-112.
|
14 |
黄波. 电连接器耦合失效机理及可靠性研究[D]. 成都: 电子科技大学, 2016: 92-102.
|
|
HUANG B. Research on coupling failure mechanism and reliability for electrical connector[D].Chengdu: University of Electronic Science and Technology of China, 2016: 92-102. (in Chinese)
|
15 |
高鹏宇. 10Gbps高速连接器传输性能研究[D]. 天津: 河北工业大学, 2022: 31-52.
|
|
GAO P Y. Research on transmission performance of 10 Gbps high-speed connector[D].Tianjin: Hebei University of Technology, 2022: 31-52. (in Chinese)
|
16 |
LUNDQUIST E J, FURSE C. Connector impedance and frequency modes in aerospace wiring systems[J]. Microwave and Optical Technology Letters, 2017, 59(1): 89-93.
|
17 |
徐晓丹. 高速高密度PCB信号完整性与电源完整性研究[D]. 成都: 西南交通大学, 2015: 56-61.
|
|
XU X D. Study of signal integrity and power integrity based on the high-speed and high density PCB[D].Chengdu: Southwest Jiaotong University, 2015: 56-61. (in Chinese)
|
18 |
BEN R R, HU S Q, LI X M, et al. Signal intergrity analysis for SMA via on the PCB[C]∥ 2017 IEEE 9th International Conference on Communication Software and Networks (ICCSN). Piscataway: IEEE Press, 2017: 865-869.
|
19 |
梁云忠, 李红, 伍权, 等. 高速传输电连接器差分阻抗优化[J]. 电子测量与仪器学报, 2017, 31(3): 481-486.
|
|
LIANG Y Z, LI H, WU Q, et al. Differential impedance optimization of high speed electric connector[J]. Journal of Electronic Measurement and Instrumentation, 2017, 31(3): 481-486 (in Chinese).
|
20 |
梁云忠, 李红, 徐卫平. 基于电磁兼容的高速传输电连接器结构优化[J]. 微波学报, 2017, 33(6): 66-69.
|
|
LIANG Y Z, LI H, XU W P. Structure improvement of high-speed transmission electrical connector base on electromagnetic compatibility[J]. Journal of Microwaves, 2017, 33(6): 66-69 (in Chinese).
|
21 |
苏浩航, 闫静纯. 10 Gbit/s高速串行通道的优化设计与研究[J]. 微波学报, 2020, 36(5): 12-17.
|
|
SU H H, YAN J C. The optimum design and analysis of 10 Gbit/s high-speed serial channel[J]. Journal of Microwaves, 2020, 36(5): 12-17 (in Chinese).
|
22 |
WANG L J, WU C Q, FAN L F, et al. Investigation of wave reflection at the joint with different wave impedances on two sides[J]. Waves in Random and Complex Media, 2023, 33(2): 237-253.
|
23 |
GONG Z F, CHEN K, WANG W, et al. A pressure-sensitive fiber optic connector for loss analysis of physical contact[J]. Optical Fiber Technology, 2017, 36(7): 134-138.
|
24 |
LI C H, LI T, GUELBENZU G, et al. Chip scale 12-channel 10 GB/s optical transmitter and receiver subassemblies based on wet etched silicon interposer[J]. Journal of Lightwave Technology, 2017, 35(15): 3229-3236.
|
25 |
JI R, FLOWERS G T, GAO J C, et al. High-frequency characterization and modeling of coaxial connectors with degraded contact surfaces[J]. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2018, 8(3): 447-455.
|
26 |
BOUJMAD Y, BERMOND C, ARTILLAN P, et al. Design of a high-speed Ethernet connector for harsh environments[J]. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2020, 10(10): 1684-1692.
|
27 |
CHU Y H, XIAO K, HO Y, et al. SNEM: Full S-parameter synthesis from near-end measurement[J]. IEEE Transactions on Electromagnetic Compatibility, 2017, 59(4): 1302-1311.
|